Hypcon: Difference between revisions
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The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||
A [[Media:7104_maintenance.pdf|Tek-internal introduction to 7104 maintenance]] discusses Hypcon-related technical and manufacturing issues in detail. | |||
==Links== | ==Links== | ||
Revision as of 15:22, 23 October 2016
Hypcon, for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances.
The package and sockets were created for the hybrids in the 7104 that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the 155-0176-00.
A Tek-internal introduction to 7104 maintenance discusses Hypcon-related technical and manufacturing issues in detail.
Links
- US Pat. 4.150.420 Electrical Connector (filed Dec 15, 1977)