Hypcon: Difference between revisions
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[[File:Tek_7104_vertampclose.jpg|thumb|right| | [[File:Tek_7104_vertampclose.jpg|thumb|right|300px|Hypcon-packaged amplifier ICs in a [[7104]]]] | ||
'''Hypcon''', for "'''hy'''brid to '''p'''rinted board '''con'''nector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | '''Hypcon''', for "'''hy'''brid to '''p'''rinted board '''con'''nector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | ||
[[File:Tek-hypcon.jpg|thumb| | [[File:Tek-hypcon.jpg|thumb|300px|right|Hypcon explosion drawing (click to enlarge)]] | ||
The package and sockets were created for the hybrids in the [[7104]] generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||
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==Links== | ==Links== | ||
* [ | * [[William E. Berg]] | ||
* [[Patent US 4150420A]], ''Electrical connector'', filed 1977-12-15 | |||
* [[Patent US 4255003A]], ''Electrical connector'', filed 1979-01-29 | |||
* [[Patent US 4400234A]], ''Method of manufacturing electrical connector'', filed 1982-04-15 | |||
{{Documents|Link=Hypcon}} | |||
[[Category:Packages]] | [[Category:Packages]] | ||
Latest revision as of 00:29, 13 December 2023
Hypcon, for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances.
The package and sockets were created for the hybrids in the 7104 generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the 155-0176-00.
A Tek-internal introduction to 7104 maintenance discusses Hypcon-related technical and manufacturing issues in detail.
See also Category:Hypcon.
Links
- William E. Berg
- Patent US 4150420A, Electrical connector, filed 1977-12-15
- Patent US 4255003A, Electrical connector, filed 1979-01-29
- Patent US 4400234A, Method of manufacturing electrical connector, filed 1982-04-15
Documents Referencing Hypcon
| Document | Class | Title | Authors | Year | Links |
|---|---|---|---|---|---|
| Tekscope 1979 V11 N1.pdf | Article | 1 GHz at 1 mV in a General Purpose Plug-in Oscilloscope | Hans Springer | 1979 | 7104 • Hypcon • SHFIII • 7A29 • 7B10 • 7B15 |