Patent US 4628406A

Patent number	US 4628406A (click link for details and documents via Google Patents)
Title	Method of packaging integrated circuit chips, and integrated circuit package
Inventors	Kenneth R. Smith, Kent H. Johnston, George S. LaRue, Robert A. Mueller, Steven A. Tabor
Company	Tektronix Inc
Filing date	1985-05-20
Grant date	1986-12-09