Patent US 4628406A

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Patent number US 4628406A (click link for details and documents via Google Patents)
Title Method of packaging integrated circuit chips, and integrated circuit package
Inventors Kenneth R. Smith, Kent H. Johnston, George S. LaRue, Robert A. Mueller, Steven A. Tabor
Company Tektronix Inc
Filing date 1985-05-20
Grant date 1986-12-09



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