1 row is stored for this page
| Field | Field type | Value |
|---|
| _creationDate | Datetime | 2021-08-31 11:22:06 AM |
| _modificationDate | Datetime | 2021-08-31 11:22:06 AM |
| _categories | List of String, delimiter: | | Patents |
| _isRedirect | Boolean | No |
| _pageID | Integer | 27,960 |
| _pageName | Page | Patent US 4628406A |
| _pageTitle | String | Patent US 4628406A
|
| _pageNamespace | Integer | 0 |
1 row is stored for this page
| Field | Field type | Value |
|---|
| Office | String | US |
| Number | String | 4628406A |
| Title | String | Method of packaging integrated circuit chips, and integrated circuit package |
| Inventors | List of Page, delimiter: ; | Kenneth R. Smith • Kent H. Johnston • George S. LaRue • Robert A. Mueller • Steven A. Tabor |
| Company | List of Page, delimiter: ; | Tektronix Inc |
| Filing_date | Date | 1985-05-20 |
| Grant_date | Date | 1986-12-09 |
| Cites | List of Page, delimiter: ; | |
| Links | List of Page, delimiter: ; | |