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Field | Field type | Value |
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_creationDate | Datetime | 2021-08-31 11:24:20 AM |
_modificationDate | Datetime | 2021-08-31 11:24:20 AM |
_categories | List of String, delimiter: | | Patents |
_isRedirect | Boolean | No |
_pageID | Integer | 28,151 |
_pageName | Page | Patent US 4734641A |
_pageTitle | String | Patent US 4734641A
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_pageNamespace | Integer | 0 |
1 row is stored for this page
Field | Field type | Value |
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Office | String | US |
Number | String | 4734641A |
Title | String | Method for the thermal characterization of semiconductor packaging systems |
Inventors | List of Page, delimiter: ; | Dee H. Byrd Jr. • Michael H. Williams |
Company | List of Page, delimiter: ; | Tektronix Inc |
Filing_date | Date | 1987-03-09 |
Grant_date | Date | 1988-03-29 |
Cites | List of Page, delimiter: ; | |
Links | List of Page, delimiter: ; | |