Page values for "Patent US 4734641A"
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"_pageData" values
1 row is stored for this page| Field | Field type | Value |
|---|---|---|
| _creationDate | Datetime | 2021-08-31 11:24:20 AM |
| _modificationDate | Datetime | 2021-08-31 11:24:20 AM |
| _categories | List of String, delimiter: | | Patents |
| _isRedirect | Boolean | No |
| _pageID | Integer | 28,151 |
| _pageName | Page | Patent US 4734641A |
| _pageTitle | String | Patent US 4734641A |
| _pageNamespace | Integer | 0 |
"Patents" values
1 row is stored for this page| Field | Field type | Value |
|---|---|---|
| Office | String | US |
| Number | String | 4734641A |
| Title | String | Method for the thermal characterization of semiconductor packaging systems |
| Inventors | List of Page, delimiter: ; | Dee H. Byrd Jr. • Michael H. Williams |
| Company | List of Page, delimiter: ; | Tektronix Inc |
| Filing_date | Date | 1987-03-09 |
| Grant_date | Date | 1988-03-29 |
| Cites | List of Page, delimiter: ; | |
| Links | List of Page, delimiter: ; |