Patent US 4946716A

From TekWiki
Revision as of 04:28, 31 August 2021 by Maintenance script (talk | contribs)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search
Patent number US 4946716A (click link for details and documents via Google Patents)
Title Method of thinning a silicon wafer using a reinforcing material
Inventors Brian L. Corrie
Company Tektronix Inc
Filing date 1988-12-27
Grant date 1990-08-07



Retrieved from "https://w140.com/tekwiki/index.php?title=Patent_US_4946716A&oldid=67938"