Patent US 4946716A
Jump to navigation
Jump to search
| Patent number | US 4946716A (click link for details and documents via Google Patents) |
|---|---|
| Title | Method of thinning a silicon wafer using a reinforcing material |
| Inventors | Brian L. Corrie |
| Company | Tektronix Inc |
| Filing date | 1988-12-27 |
| Grant date | 1990-08-07 |