Patent US 4597617A
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Patent number | US 4597617A (click link for details and documents via Google Patents) |
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Title | Pressure interconnect package for integrated circuits |
Inventors | Raymond S. Enochs |
Company | Tektronix Inc |
Filing date | 1984-03-19 |
Grant date | 1986-07-01 |
See e.g. 155-0242-00.