Patent US 4597617A
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| Patent number | US 4597617A |
|---|---|
| Title | Pressure interconnect package for integrated circuits |
| Inventors | Raymond S. Enochs |
| Company | Tektronix Inc |
| Filing date | 1984-03-19 |
| Grant date | 1986-07-01 |
| Cites |
See e.g. 155-0242-00.