Patent US 4647959A
Jump to navigation
Jump to search
| Patent number | US 4647959A (click link for details and documents via Google Patents) |
|---|---|
| Title | Integrated circuit package, and method of forming an integrated circuit package |
| Inventors | Kenneth R. Smith |
| Company | Tektronix Inc |
| Filing date | 1985-05-20 |
| Grant date | 1987-03-03 |