Patent US 4686492A
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| Patent number | US 4686492A |
|---|---|
| Title | Impedance match connection using multiple layers of bond wires |
| Inventors | Heinz Erwin Grellmann, Leonard A. Roland |
| Company | Tektronix Inc |
| Filing date | 1985-03-04 |
| Grant date | 1987-08-11 |
| Cites |