155-0175-00: Difference between revisions
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|Used_in=7904A;7912HB;7934;7104;R7103;7A29;7A29P;7F10;067-0587-02;067-0587-10;11A71;SCD1000;EG&G N-AM-173A | |Used_in=7904A;7912HB;7934;7104;R7103;7A29;7A29P;7F10;067-0587-02;067-0587-10;11A71;SCD1000;EG&G N-AM-173A | ||
|Designers=John Addis;Wink Gross;Carl Battjes | |Designers=John Addis;Wink Gross;Carl Battjes | ||
}} in a [[Hypcon]] package, implemented as a thin-film ceramic hybrid using an [[M178]] die. | }} in a [[Hypcon]] package, implemented as a thin-film ceramic hybrid using an [[M178]] die implemented in the [[SHFIII]] process. | ||
It was designed by [[John Addis]] and uses the "[[ft doubler|f<sub>t</sub> doubler]]" circuit patented by [[Carl Battjes]] in its first stage. | It was designed by [[John Addis]] and uses the "[[ft doubler|f<sub>t</sub> doubler]]" circuit patented by [[Carl Battjes]] in its first stage. | ||