M777: Difference between revisions

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Kurt

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 They hired me to help with implementing the M377 in the [[TDS540]].
 The M377 was repackaged in a small 16 pin package with just a big heat sink on top and soldered onto the ECB.
-ECB space was even smaller than the 11K plugins, although it definitely ran hotter.
+ECB space was even tighter than the 11K plugins, and the M377 definitely ran hotter.
 I also sold another Portable Scopes group on using the M377 as it was exactly what they needed too.
-I believe this became the [[2245]], [[2247]], and [[2252]] series.
+I believe this became the [[2245]], [[2245A]], [[2247]], [[2247A]], and [[2252]] series.
-Thus the M377 is used in more than the 11K and [[:Category:TDS500_series_scopes|TDS500 series scopes]].
+Thus the M377 is used in more than just the 11K and [[:Category:TDS500_series_scopes|TDS500 series scopes]].
-My principal job was to redesign the M377 with the new SHPi process. It would be known as the M777.
+My principal job in Portables was to redesign the M377 with the new SHPi process. It would be known as the M777.
 [[Bob Woolhiser]] left Tek’s excellent CAD group and worked with me to implement the M777.
-I left Tektronix before the M777 was finished, but it was in capable hands.  Woolhiser had responsibility for the M777.
+I left Tektronix in April 1991 before the M777 was finished, but it was in capable hands.
+Woolhiser had responsibility for the M777.
+Woolhiser implemented the 250MHz BWL filter in place of the 100MHz BWL filter in the M377.
+He too moved on and [[Rich Huard]] finished the M777.
-The M777 is bond pad compatible in every way with the M377, but faster.  And because of the extra bandwidth, it was also a little noisier.
+The M777 is bond pad compatible in every way with the M377, but faster.
+And because of the extra bandwidth, it was also a little noisier.
 The M377 had a long life, still in production after Maxim Integrated bought the Tektronix IC facility (Building 59).
-Part of the purchase price was support for the Tektronix IC processes, including SH3, SHPi (included P channel JFETs), and Cpi (included high speed complementary PNPs).
+Part of the purchase agreement was support for the Tektronix IC processes,
+including SH3, SHPi (included P channel JFETs), and Cpi (included high speed complementary PNPs).
 I cannot speak with authority about these later years.
 There was a chip that included the input IC for the TDS540 series that [[Art Metz]] and I designed using the P channel JFETs.
-Eventually, I believe, the two chips were combined into a new IC based on both these designs.  However, I believe the M377 and M777 continued in production until Maxim stopped.
+Eventually, I believe, the two chips were combined into a new IC based on both these designs.
+However, I believe the M377 and M777 continued in production until Maxim stopped.
-There was some friction between Maxim and Tektronix as Maxim was bound by contract to supply legacy parts.  Eventually (about 1997) the Tektronix processes went out of production.
+There was some friction between Maxim and Tektronix as Maxim was bound by contract to supply legacy parts.
+Eventually (about 1997) the Tektronix processes went out of production.
 </blockquote>
 [[Category:Tektronix-made monolithic integrated circuits]]