Patent US 4597617A: Difference between revisions
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|Grant date=1986-07-01 | |Grant date=1986-07-01 | ||
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See e.g. [[155-0242-00]]. | |||
Latest revision as of 07:35, 15 December 2022
| Patent number | US 4597617A (click link for details and documents via Google Patents) |
|---|---|
| Title | Pressure interconnect package for integrated circuits |
| Inventors | Raymond S. Enochs |
| Company | Tektronix Inc |
| Filing date | 1984-03-19 |
| Grant date | 1986-07-01 |
See e.g. 155-0242-00.