585/Repairs: Difference between revisions

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:'''Solution:''' Replace cap
:'''Solution:''' Replace cap
:<gallery>
:<gallery>
585-c808-therm.jpg | Thermal image
585-c808.jpg      | bulging cap
</gallery>
</gallery>
:--[[User:Peter|Peter]] ([[User talk:Peter|talk]]) 02:45, 4 May 2019 (PDT)
:--[[User:Peter|Peter]] ([[User talk:Peter|talk]]) 02:45, 4 May 2019 (PDT)

Revision as of 05:51, 4 May 2019

Supplies out of regulation

Symptom: Several supplies out of regulation
Root cause: dry HV electrolytics
Solution: Rebuild caps using modern replacements
  • Remove defective cap

    Remove defective cap

  • Cut can near base, remove guts

    Cut can near base, remove guts

  • Fit modern cap

    Fit modern cap

  • Epoxy cap onto base

    Epoxy cap onto base

  • --Peter (talk) 02:45, 4 May 2019 (PDT)

    HV low and trace invisible

    Symptom: No trace, HV low despite maximum setting
    Root cause: HV PIO "Bumble Bee" capacitors leaky (~180 μA at 2 kV); no trace because CRT grid too negative wrt. cathode
    Solution: Replace caps
  • old PIO caps in place

    old PIO caps in place

  • old PIO caps removed

    old PIO caps removed

  • new ceramic caps

    new ceramic caps

  • --Peter (talk) 02:45, 4 May 2019 (PDT)

    No trace

    Symptom: Trace invisible
    Root cause: Wiper of focus pot not in contact
    Solution: Disassemble focus pot, clean and re-seat wiper
    --Peter (talk) 02:45, 4 May 2019 (PDT)

    Trace disappearing

    Symptom: Trace fading after ~10 minutes operation
    Root cause: HV resonant cap (C808) leaky, overheating (visible bulge)
    Solution: Replace cap
  • Thermal image

    Thermal image

  • bulging cap

    bulging cap

  • --Peter (talk) 02:45, 4 May 2019 (PDT)

    Time base inoperative

    Symptom: No trace
    Root cause: Lead of neon bulb in Miller integrator (B171?) broken
    Solution: Solder replacement lead after grinding away some glass (or replace neon)
  • broken lead

    broken lead

  • repaired leads (before encapsulation with epoxy)

    repaired leads (before encapsulation with epoxy)

  • --Peter (talk) 02:45, 4 May 2019 (PDT)