Hypcon: Difference between revisions
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Revision as of 01:16, 4 April 2015
Hypcon is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances.
The package and sockets were created for the hybrids in the 7104 that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the 155-0176-00.