Hypcon

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Hypcon-packaged amplifier ICs in a 7104

Hypcon, for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances.

Hypcon explosion drawing (click to enlarge)

The package and sockets were created for the hybrids in the 7104 generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the 155-0176-00.

A Tek-internal introduction to 7104 maintenance discusses Hypcon-related technical and manufacturing issues in detail.

See also Category:Hypcon.

Links


Patents that may apply to Hypcon

Page Title Inventors Filing date Grant date Links
Patent US 4150420A Electrical connector William E. Berg 1977-12-15 1979-04-17
Patent US 4255003A Electrical connector William E. Berg 1979-01-29 1981-03-10
Patent US 4400234A Method of manufacturing electrical connector William E. Berg 1982-04-15 1983-08-23

Documents Referencing Hypcon

Document Class Title Authors Year Links
Tekscope 1979 V11 N1.pdf Article 1 GHz at 1 mV in a General Purpose Plug-in Oscilloscope Hans Springer 1979