Hypcon
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Hypcon, for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances.
The package and sockets were created for the hybrids in the 7104 generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the 155-0176-00.
A Tek-internal introduction to 7104 maintenance discusses Hypcon-related technical and manufacturing issues in detail.
See also Category:Hypcon.
Links
Patents that may apply to Hypcon
| Page | Title | Inventors | Filing date | Grant date | Links |
|---|---|---|---|---|---|
| Patent US 4150420A | Electrical connector | William E. Berg | 1977-12-15 | 1979-04-17 | Hypcon |
| Patent US 4255003A | Electrical connector | William E. Berg | 1979-01-29 | 1981-03-10 | Hypcon |
| Patent US 4400234A | Method of manufacturing electrical connector | William E. Berg | 1982-04-15 | 1983-08-23 | Hypcon |
Documents Referencing Hypcon
| Document | Class | Title | Authors | Year | Links |
|---|---|---|---|---|---|
| Tekscope 1979 V11 N1.pdf | Article | 1 GHz at 1 mV in a General Purpose Plug-in Oscilloscope | Hans Springer | 1979 | 7104 • Hypcon • SHFIII • 7A29 • 7B10 • 7B15 |