Patent US 4597617A: Difference between revisions

Latest revision as of 07:35, 15 December 2022

Patent number	US 4597617A (click link for details and documents via Google Patents)
Title	Pressure interconnect package for integrated circuits
Inventors	Raymond S. Enochs
Company	Tektronix Inc
Filing date	1984-03-19
Grant date	1986-07-01

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	See [[~~Hypcon~~]].		See e.g. [[155-0242-00]].