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155-0150-00: Difference between revisions
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}}. It incorporates a [[203-0122-00]] (M122) die implemented in the [[SHFIII]] process, and comes in a [[Hypcon]] package (apparently one of the earliest Tek circuits to use this package). It was designed by [[Art Metz]]. | }}. It incorporates a [[203-0122-00]] (M122) die implemented in the [[SHFIII]] process, and comes in a [[Hypcon]] package (apparently one of the earliest Tek circuits to use this package). It was designed by [[Art Metz]]. | ||
==Datasheet== | |||
* [[Media:Tek 155-0150-00.pdf|Tektronix 155-0150-00 Datasheet (PDF)]] | |||
==Pictures== | |||
<gallery> | |||
Tek 155-0150-00.jpg | |||
</gallery> | |||
==Used in== | ==Used in== | ||
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* [[SCD1000]] | * [[SCD1000]] | ||
{{Part usage}} | |||
[[Category:Tektronix-made hybrid integrated circuits]] | [[Category:Tektronix-made hybrid integrated circuits]] | ||
[[Category:Hypcon]] | [[Category:Hypcon]] | ||
[[Category:Introduced in 1976]] | [[Category:Introduced in 1976]] | ||