155-0150-00: Difference between revisions

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|Designers=Art Metz
|Designers=Art Metz
}}. It incorporates a [[203-0122-00]] (M122) die implemented in the [[SHFIII]] process, and comes in a [[Hypcon]] package (apparently one of the earliest Tek circuits to use this package).  It was designed by [[Art Metz]].
}}. It incorporates a [[203-0122-00]] (M122) die implemented in the [[SHFIII]] process, and comes in a [[Hypcon]] package (apparently one of the earliest Tek circuits to use this package).  It was designed by [[Art Metz]].
==Datasheet==
* [[Media:Tek 155-0150-00.pdf|Tektronix 155-0150-00 Datasheet (PDF)]]
==Pictures==
<gallery>
Tek 155-0150-00.jpg
</gallery>


==Used in==
==Used in==
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* [[SCD1000]]
* [[SCD1000]]


==Datasheet==
{{Part usage}}
* [[Media:Tek 155-0150-00.pdf|Tektronix 155-0150-00 Datasheet (PDF)]]
 
<gallery>
Tek 155-0150-00.jpg
</gallery>


[[Category:Tektronix-made hybrid integrated circuits]]
[[Category:Tektronix-made hybrid integrated circuits]]
[[Category:Hypcon]]
[[Category:Hypcon]]
[[Category:Introduced in 1976]]
[[Category:Introduced in 1976]]

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