155-0176-00: Difference between revisions

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|Used_in=7104;SCD1000
|Used_in=7104;SCD1000
|Designers=Wink Gross
|Designers=Wink Gross
}} in a [[Hypcon]] package.  It is based on the [[M196]] die and was designed by [[Wink Gross]].
}} in a [[Hypcon]] package.  It is based on the [[M196]] die implemented in the [[SHFIII]] process, and was designed by [[Wink Gross]].


==Used in==
==Used in==
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==Datasheet==
==Datasheet==
* [[Media:Tek 155-0176-00.pdf|Tektronix 155-0176-00 Datasheet (PDF)]]
* [[Media:Tek 155-0176-00.pdf|Tektronix 155-0176-00 Abridged Datasheet]]
* [[Media:155-0176-00.pdf]]
* [[Media:155-0176-00.pdf|Tektronix 155-0176-00 Datasheet]]


==Note==
==Note==

Revision as of 04:53, 27 February 2022

The Tektronix H477  (P/N 155-0176-00) is a vertical output amplifier hybrid integrated circuit in a Hypcon package. It is based on the M196 die implemented in the SHFIII process, and was designed by Wink Gross.

Used in

Datasheet

Note

Warning - Beryllium oxide substrate

Photos