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203-0130-90: Difference between revisions
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Two chips are combined on a ceramic substrate with heatsink and printed resistors to form the [[155-0155-00]] (H332). | Two chips are combined on a ceramic substrate with heatsink and printed resistors to form the [[155-0155-00]] (H332). | ||
==Datasheet== | |||
* [[Media:Tek 203-0130-90.pdf|Tektronix 203-0130-90 Datasheet]] | |||
==Used in== | ==Used in== | ||
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* [[155-0155-00]] | * [[155-0155-00]] | ||
* [[155-0161-00]] | * [[155-0161-00]] | ||
{{Part usage}} | |||
[[Category:Tektronix-made monolithic integrated circuits]] | [[Category:Tektronix-made monolithic integrated circuits]] | ||