39,728
edits
M377: Difference between revisions
Jump to navigation
Jump to search
no edit summary
No edit summary |
No edit summary |
||
| Line 28: | Line 28: | ||
If the instrument has more than 300 MHz bandwidth at 1 mV/div sensitivity, | If the instrument has more than 300 MHz bandwidth at 1 mV/div sensitivity, | ||
it can be assumed to be using the M777 which makes use of Tek's later IC fabrication process | it can be assumed to be using the M777 which makes use of Tek's later IC fabrication process | ||
that provides | that provides transistors with higher f<sub>t</sub>. | ||
The M377 and M777 are in the following instruments based on the specified bandwidth at 1 mV/div: | The M377 and M777 are in the following instruments based on the specified bandwidth at 1 mV/div: | ||
| Line 73: | Line 73: | ||
TDS series oscilloscopes use a J lead package with a tall heat sink. The package is soldered to the circuit board. | TDS series oscilloscopes use a J lead package with a tall heat sink. The package is soldered to the circuit board. | ||
The | The 200 Ω output impedance of the version for the four-channel 11A34 (50 Ω resulting with four paralleled outputs) is achieved in the laser trimming stage of wafer production. | ||
Tek part numbers: | |||
{| class="wikitable" | {| class="wikitable" | ||