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[[File:Tek-hypcon.jpg|thumb|500px|right|Hypcon explosion drawing]] | [[File:Tek-hypcon.jpg|thumb|500px|right|Hypcon explosion drawing]] | ||
'''Hypcon''' is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | '''Hypcon''', for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | ||
The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||
==Links== | |||
* [http://www.google.com/patents/US4150420 US Pat. 4.150.420 Electrical Connector] (filed Dec 15, 1977) | |||
[[Category:Packages]] | [[Category:Packages]] | ||