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Hypcon: Difference between revisions
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The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||
A [[Media:7104_maintenance.pdf|Tek-internal introduction to 7104 maintenance]] discusses Hypcon-related technical and manufacturing issues in detail. | |||
==Links== | ==Links== | ||