Patent US 4597617A

From TekWiki
Revision as of 07:25, 15 December 2022 by Peter (talk | contribs)
Jump to navigation Jump to search
Patent number US 4597617A (click link for details and documents via Google Patents)
Title Pressure interconnect package for integrated circuits
Inventors Raymond S. Enochs
Company Tektronix Inc
Filing date 1984-03-19
Grant date 1986-07-01




See Hypcon.