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[[File:Tek_7104_vertampclose.jpg|thumb|right|350px|Hypcon-packaged amplifier ICs in a [[7104]]]] | [[File:Tek_7104_vertampclose.jpg|thumb|right|350px|Hypcon-packaged amplifier ICs in a [[7104]]]] | ||
'''Hypcon''', for " | '''Hypcon''', for "'''hy'''brid to '''p'''rinted board '''con'''nector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | ||
[[File:Tek-hypcon.jpg|thumb|450px|right|Hypcon explosion drawing (click to enlarge)]] | [[File:Tek-hypcon.jpg|thumb|450px|right|Hypcon explosion drawing (click to enlarge)]] | ||
The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||
A [[Media:7104_maintenance.pdf|Tek-internal introduction to 7104 maintenance]] discusses Hypcon-related technical and manufacturing issues in detail. | A [[Media:7104_maintenance.pdf|Tek-internal introduction to 7104 maintenance]] discusses Hypcon-related technical and manufacturing issues in detail. | ||
See also [[:Category:Hypcon]]. | |||
==Links== | ==Links== | ||