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Hypcon: Difference between revisions
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'''Hypcon''', for "'''hy'''brid to '''p'''rinted board '''con'''nector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | '''Hypcon''', for "'''hy'''brid to '''p'''rinted board '''con'''nector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | ||
[[File:Tek-hypcon.jpg|thumb| | [[File:Tek-hypcon.jpg|thumb|350px|right|Hypcon explosion drawing (click to enlarge)]] | ||
The package and sockets were created for the hybrids in the [[7104]] generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] generation instruments that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||