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Hypcon: Difference between revisions
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[[File: | [[File:Tek_7104_vertampclose.jpg|thumb|right|350px|Hypcon-packaged amplifier ICs in a [[7104]]]] | ||
'''Hypcon''', for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | '''Hypcon''', for "hybrid to printed board connector", is a Tektronix trade mark for an elastomer-based packaging and connection system that allows ceramic thin-film hybrid integrated circuits to connect to PCBs directly, with controlled impedances. | ||
[[File:Tek-hypcon.jpg|thumb|450px|right|Hypcon explosion drawing (click to enlarge)]] | |||
The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | The package and sockets were created for the hybrids in the [[7104]] that required precisely controlled matching of impedances between the PCB and the ceramic substrate carrying the hybrid amplifiers such as the [[155-0176-00]]. | ||