155-0175-00: Difference between revisions

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|Used_in=7904A;7912HB;7934;7104;R7103;7A29;7A29P;7F10;067-0587-02;067-0587-10;11A71;SCD1000;EG&G N-AM-173A
|Used_in=7904A;7912HB;7934;7104;R7103;7A29;7A29P;7F10;067-0587-02;067-0587-10;11A71;SCD1000;EG&G N-AM-173A
|Designers=John Addis;Wink Gross;Carl Battjes
|Designers=John Addis;Wink Gross;Carl Battjes
}} in a [[Hypcon]] package, implemented as a thin-film ceramic hybrid using an [[M178]] die.
}} in a [[Hypcon]] package, implemented as a thin-film ceramic hybrid using an [[M178]] die implemented in the [[SHFIII]] process.


It was designed by [[John Addis]] and uses the "[[ft doubler|f<sub>t</sub> doubler]]" circuit patented by [[Carl Battjes]] in its first stage.
It was designed by [[John Addis]] and uses the "[[ft doubler|f<sub>t</sub> doubler]]" circuit patented by [[Carl Battjes]] in its first stage.

Revision as of 03:51, 27 February 2022

The Tektronix H476  (P/N 155-0175-00,155-0175-05) is a broadband amplifier monolithic integrated circuit in a Hypcon package, implemented as a thin-film ceramic hybrid using an M178 die implemented in the SHFIII process.

It was designed by John Addis and uses the "ft doubler" circuit patented by Carl Battjes in its first stage.

Designers:

Used in

Datasheet